Detailed Product Description
Specifications: Board layer: 4 Material: FR-4 Minimum board thickness: 0.6mm Minimum line width: 0.25mm Minimum line spacing: 0.18mm Minimum hole diameter: 1.25mm Surface finishing: OSP / Entek / HAL Board thickness: 1.5mm Packing: Vacuum packing Main export markets: Eastern Europe, Western Europe, North America, Asia
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